Advanced sensors are in almost every consumer product, car, and home. Looking toward the future, even more sensors will be packed into each device.
“I look for advanced sensor technologies to be used in future Bosch products.”
Engineer for development of new sensor fabrication processes to be used in next-generation products. I review new materials and processes and, depending on how promising they look, integrate them into prototypes for enhancement of sensor functionality. Using the cleanroom Stanford University wafer fabrication facility, parts are fabricated for proof of concept. If successful and there is market demand, they are transferred for mass production. Some of these parts are now commercialized for use in timing references by the spin-off company, SiTime.
Idea of the Year Winner, "A Novel Non-Contact Thermometer in Smartphones"
Worked with the Corporate Research team in Amerika North on the technology development of the MEMS based infrared temperature sensor.
J. Stehle et al. (2014)Silicon migration of through-holes in single- and poly-crystalline silicon membranes
- J. Stehle, V.A. Hong, A. Feyh, G.J. O’Brien, G. Yama, O. Ambacher, B. Kim, T.W. Kenny
- Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, p. 32-35
F. Purkl et al. (2013)Serpentine geometry for enhanced performance of nanometer-thin platinum bolometers
- F. Purkl, T. S. English, G. Yama, J. Provine, A. K. Samarao, A. Feyh, B. Kim, G. O'Brien, O. Ambacher, R. T. Howe, T. W. Kenny
- The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, p. 1507-1510
F. Purkl et al. (2013)Sub-10 nanometer uncooled platinum bolometers via plasma enhanced atomic layer deposition
- F. Purkl, T. English, G. Yama, J. Provine, A. K. Samarao, A. Feyh, G. O'Brien, O. Ambacher, R. T. Howe, T. W. Kenny
- IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS), p. 185-188
E.J. Ng et al. (2012)Ultra-stable epitaxial polysilicon resonators
- E.J. Ng, S. Wang, D. Buchman, C.-F. Chiang, T.W. Kenny, H. Muenzel, M. Fuertsch, J. Marek, U.M. Gomez, G. Yama, G. O’Brien
- Hilton Head, p. 271-274
S. Yoneoka et al. (2011)ALD-metal uncooled bolometer
- M. Liger, G. Yama, R. Schuster, F. Purkl, J Provine, F. B. Prinz, R. T. Howe, T. W. Kenny
- IEEE 24th International Conference on Micro Electro Mechanical Systems, p. 676-679
B. Kim et al. (2007)Si-SiO2 Composite MEMS Resonators in CMOS Compatible Wafer-scale Thin-Film Encapsulation
- R. Melamud, M.A. Hopcroft, S.A. Chandorkar, G. Bahl, M. Messana, R.N. Candler, G. Yama, T. Kenny
- IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, p. 1214-1219
B. Kim et al. (2007)Using MEMS to Build the Device and the Package
- B. Kim, M. Hopcroft, C.M Jha, R. Melamud, S. Chandorkar, M. Agarwal, K. L. Chen, W. T. Park, R. Candler, G. Yama, A. Partridge, M. Lutz, T. W. Kenny
- International Solid-State Sensors, Actuators and Microsystems Conference, p. 331-334
M.A. Hopcroft et al. (2006)Temperature Compensation of a MEMS Resonator Using Quality Factor as a Thermometer
- M.A. Hopcroft, M. Agarwal, K.K. Park, B. Kim, C.M. Jha, R.N. Candler, G. Yama, B. Murmann, T.W. Kenny
- International Conference on Micro Electro Mechanical Systems, p. 222-225
R.N. Candler et al. (2003)Investigation of energy loss mechanisms in micromechanical resonators
- R.N. Candler; H. Li, M. Lutz; W.-T. Park; A. Partridge; G. Yama; T.W. Kenny
- Digest of Technical Papers, vol. 15, issue 4, p. 332-335
W. Park et al. (2003)Wafer Scale Encapsulation of MEMS Devices
- W. Park; R. N. Candler; H. J. Li; J. Cho; H. Li; T. W. Kenny; A. Partridge; G. Yama; M. Lutz
- International Electronic Packaging Technical Conference and Exhibition, vol. 1, p. 209-212
Interview with Gary Yama
Senior Expert for MEMS Sensor Fabrication Processes
Please tell us what fascinates you most about research.
What fascinates me most about my research is that I get to take a piece of silicon and do a number of different processes on it, such as deposition, patterning, and etching. These steps, and variations of them, are repeated a number of times and the finished part is something that measures acceleration, temperature, rotation, time, or other components.
What makes research done at Bosch so special?
Research at Bosch is special because one has the freedom to try new and different things. If something does not turn out as planned, one can move on to try something else that may have the potential to work out.
What research topics are you currently working on at Bosch?
The research topics I am working on are graphene synthesis for bio-medical applications and a DNA sensing chip.
What are the biggest scientific challenges in your field of research?
The biggest scientific challenges for my research are being able to develop a process that works for the targeted type of sensing. One always has to keep in mind that at some point, if the project is successful, millions and millions of these parts will have to be made and the research and development process will have to be scaled up to mass production.
How do the results of your research become part of solutions "Invented for life"?
The results of my research become part of the solutions “Invented for life” when they are used in products that are mass produced for the general public. One example is a research project that was developing a replacement for a quartz timing device out of silicon. This was a successful technology development and was a Bosch spin-off to a start-up company. Now these silicon timing devices are in a number of consumer products, including Apple Watch and Fitbit Charge 2.